EPROM

Images made through a microscope. All subject types.

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Smokedaddy
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EPROM

Post by Smokedaddy »

This was shot with the DiMAGE 5400 mounted on my Nikon MM-11, using an old Canon 50D. Images were stacked in Zerene. The magnification was 1.8x.

A link to a larger version is below. Note, once there, click on the image for a larger view, then you can pan the image.

https://squattingdog.smugmug.com/Semico ... -jL3JS6L/A

Below is a link to a video too in Helicon.

https://www.youtube.com/watch?v=_Bpn_RNktbY

And a stereo image link.

https://squattingdog.smugmug.com/Stereo ... -ttT5JbS/A

Image

-JW:

Cyclops
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Post by Cyclops »

Looks like an aerial view of a football stadium!
Canon 5D and 30D | Canon IXUS 265HS | Cosina 100mm f3.5 macro | EF 75-300 f4.5-5.6 USM III | EF 50 f1.8 II | Slik 88 tripod | Apex Practicioner monocular microscope

Lou Jost
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Post by Lou Jost »

Ah, so that's what those square cells along the edge, with silver centers, are for! I see these on lots of wafer elements, but this is the first time I saw them with wires soldered to them!

carlos.uruguay
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Post by carlos.uruguay »

Nice!!!

Smokedaddy
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Post by Smokedaddy »

Lou Jost wrote:Ah, so that's what those square cells along the edge, with silver centers, are for! I see these on lots of wafer elements, but this is the first time I saw them with wires soldered to them!
Yep, 24 pins.

Image

Image

-JW:

Smokedaddy
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Post by Smokedaddy »

This one was shot with the LOMO 3,7/0.11. Once there if you click on the image you'll get a little large image you can pan around a little.

https://squattingdog.smugmug.com/Semico ... -JfQfdL2/A

-JW:

mawyatt
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Post by mawyatt »

Lou Jost wrote:Ah, so that's what those square cells along the edge, with silver centers, are for! I see these on lots of wafer elements, but this is the first time I saw them with wires soldered to them!
Lou,

Beautiful old EPROM chip in package image by JW!!

The wires aren't soldered but themocompression bonded on the chip and wedge bonded on the package, no solder or flux is utilized. However the chip backside is soldered to the package, this is usually electronic ground for digital chips (except old ECL types) and the most negative voltage for analog chips, which may also be ground if negative supply voltages are not used.

This chip looks as if aluminum is the bond pad metal and gold wires are used.

Best,
Research is like a treasure hunt, you don't know where to look or what you'll find!
~Mike

Lou Jost
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Post by Lou Jost »

Thanks for that information Mike. It is embarassing to realize how little I know about these devices that make our world go round!

mawyatt
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Post by mawyatt »

Chips are fascinating devices indeed!!

This one JW has nicely imaged is an UV erasable EPROM (Erasable Programable Read Only Memory), where intense UV light can erase the entire chip memory. The "hole" in the package has a glass window for passing the UV light.

Later these were replaced by electronic erasable devices, known as EEPROMs. The UV EPROM technology was not generally compatible with other types of chips, so they were separate chips. When the EEPROMs were discovered and developed they could be made compatible with other chip technology and thus ended up "embedded" in our chips today. This is the means of a chip remembering things when unpowered even tho it may not be a dedicated memory chip.

An interesting example of this is with the DACs, like the ones I'm using. DACs are generally considering "Analog" chips, even tho they contain some digital circuitry. Some recent DACs have the ability to be setup to have a specific power up state without additional memory. Most DACs have a unipolar output, but may be required to operate as a bipolar device using 2's Complement coding, where all 0s is the most negative output, all 1s the most positive and the Most Significant Bit (MSB) is 1 and all other bits 0, is the "Zero" output state. Almost all DACs power up in the all bits 0 state, which is a zero output for a unipolar use, but the most negative output for bipolar use. So you have load the DAC with the MSB bit as 1 at power up and block the DAC output until the MSB is latched. All this adds additional circuitry and complexity for bipolar use. With EEPROM on the DAC chip this power up state can be set within the DAC chip and no additional circuitry is required.

Anyway, EEPROM technology has become a very valuable addition to modern chip design. The solid state physics behind the EEPROM is fascinating.


https://en.wikipedia.org/wiki/EEPROM

https://en.wikipedia.org/wiki/Field_ele ... _tunneling


Best,
Research is like a treasure hunt, you don't know where to look or what you'll find!
~Mike

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